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Atomic Layer Deposition (ALD) is a film deposition technique that deposits one monolayer at a time, that is surface self-limiting. It is capable of depositing conformal (even to the backside or in pores, trenches), pinhole-free and uniform films with atomic precision.
ALD films can be deposited at a range of temperatures from room temperature (for plastics and other sensitive materials) to 400°C.
Conformality (even in small pores, or the backside of objects), pin-hole free and highly uniform films make ALD ideal for deposition on and into nanotubes, fibers, mats, powders, spun materials, high aspect ratio optics and gratings (uniformly), templating, creating multilayers (nanolaminates), mixed compounds and doped materials (which can enhance film properties).
Atomic Layer Deposition is used to make high quality dielectric films (in electronics and microelectronics), protect surfaces, low stiction surfaces, filtration, photovoltaics, supercapacitors, flexible electronics, microfluidics, catalysts, fuel cells, batteries (including powders), blade edges, molds and dies, corrosion barriers, biocompatible coatings, SEM/TEM prep (enhancement of contrast), new materials for optics and magnetics.
Learn more about Atomic Layer Deposition (ALD) and what we can do.