AT650P

AT650P
AT 650P side view
AT650P
AT650P
AT650P
AT650P

Cost effective, Desktop Plasma ALD

  • Plasma ALD at the cost of a thermal system
  • Now with a new advanced hollow cathode source
    • Featuring: low oxygen contamination (in nitrides, etc..), high electron density, low plasma damage
  • Small Footprint (38.1 cm; 15″ across) Desktop Plasma ALD
    • Accommodates samples of 6″ diameter  or smaller.

    • Optional customizable chucks.
  • 3 organometallic source precursors to 185 °C  (1 at  standard conditions).
  • Up to 4 oxidant/reductant sources (MFC controlled).
  • High temperature compatible fast pulsing ALD valves with ultrafast MFC for
    integrated inert gas purge
  • Temperature range to 400 °C
  • High exposure available with static processing mode
  • Small Footprint (38.1 cm; 15″ across) Desktop Plasma ALD
  • High efficiency, remote 300 watt hollow cathode source
    • Features: low oxygen contamination, high electron density, low plasma damage

  • Integrated matching network
  • Accommodates samples of 6″ diameter with optional customizable chucks.
  • Warm walled aluminum chamber with heated sample holder from 40 – 400 °C
  • 3 organometallic precursors can be heated to 185 °C and an additional one at standard conditions.
  • Up to 4 oxidant/reductant sources each with ultrafast MFCs (2 standard)
  • High temperature compatible fast pulsing ALD valves with an ultrafast MFC and
    integrated inert gas purge
  • High exposure available with static processing mode
AT650P
  • Substrate temperatures from RT to 400°C ± 1 °C; Precursor temperatures from RT to 185°C ± 2°C (w/ heating jacket)
  • Small footprint (15″ by 15″), bench top installation and fully cleanroom compatible
  • Simple system maintenance and low utilities cost.
  • Streamlined chamber design and small chamber volume
  • Fast cycling capability  and high exposure, deep penetration processing available
  • Full HW and SW interlocks for safe operation even in multi-user environment.
AT 650P side view
  • Customized chuck/platen
  • QCM (Quartz Crystal Microbalance)
  • Additional Counter reactant lines (MFC controlled) – up to 2 additional
  • Optional 4th heated precursor (185°C), all available with optional pressure boost technology
  • External control – PC/software link (allows programing and running, remotely)
  • Higher than standard pressure regime

Customized systems

AT 650P Depth 38.1 cm
  • For detailed instructions see our presentation and video instructions: “AT650P Installation and Start-up
  • N2 purge gas should be >99.9995% with a shutoff valve (regulated to 10 – 30 psi, metal sealed).
    • Input line is 1/4 female VCR compression fitting
    • Attach > 99.9995% nitrogen (UHP) purge gas via 1/4″ metal line to the 1/4″ compression fitting on back
  • Attach 90-110 psi CDA (clean dry air) via 1/4″ polyethylene  tubing or metal line to the other 1/4″ compression fitting marked CDA (Clean Dry Air)
  • Min 19.5cfm wet pump (**PTFE vacuum fluid (like Fomblin) required) (Dry pump is optional)
    • NW40 (1.5″) connection and also exhaust line (with > 5cfm draw)
    • Greater than 1 meter should use NW50  exhaust line
  • Precursor’s attach via female VCR elbows (always use new gaskets).
    • Elbow: 1/4″ gasket first (with gloves on)
    • For precursor attachment please refer to “AT650P Tool and Software Operation”
AT650P

For detailed instructions see our presentation and video instructions: “AT650P Installation and Start-up

  • Human Machine Interface (HMI) PLC system with a 10” touch screen
    panel
  • Advanced controls suitable for the deposition of standard ALD cycles as
    well as e.g. Nanolaminates, Doped Thin Films and Ternary Thin Films
  • Recipe database for high quality, tested processes
  • Custom recipe input screen
  • Real time display of process status
  • Individually programmable heated source temperatures
  • Built-in pulsing sequences for ternary compounds and nano-laminates
  • Quick running with simple questions to get user going
    • Input subcycles and overall cycles
AT650 Main Screen

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  • Let us configure a tool to meet your specific requirement for example custom chambers, custom wafer holders – Ask us
  • Let us develop a process specifically for you based on your requirements – Ask us
  • If you don’t think we have the equipment you need you will be surprised – Ask us