AT610

At-400 Anric Technologies

The AT610 is the most cost-effective 6″ thermal ALD tool on the market. 

  • Small Footprint Desktop System
  • Semiconductor-grade metal sealed lines and high temperature compatible fast pulsing ALD valves.
  • Ultrafast MFC for integrated inert gas purge.
  • 6 inch circular chuck (up to 7″ square) customizable for smaller sizes or other shapes (11 mm tall).
  • 3 organometallic precursors and 2 (up to 3) counter reactants.
  • Heated lines throughout (from precursor to chamber).
  • All aluminum (semiconductor grade) chamber ‒ range up to 310°C
  • 7” touchscreen PLC controller (no PC required).
  • Small Footprint Desktop System, cleanroom compatible.
  • All aluminum (semiconductor grade) chamber ‒ range up to 310°C
  • High temperature semiconductor grade fast pulsing ALD valves with ultrafast MFC for integrated inert gas purge.
  • 6″ circular chuck (7″ square)customizable for smaller sizes or other shapes (11 mm tall).
  • Streamlined chamber design and small chamber volume
  • 3 organometallic precursors and 2 (up to 3) counter reactants.
    • Precursors can be heated to 150°C.
  • Heated lines throughout (from precursor through to chamber).
  • Simple system maintenance and lowest utilities and precursor usage on market
  • High exposure (for trenches and porous substrates) and static processing mode
  • 7″ touchscreen PLC controller (no PC required)
At-400 Anric Technologies
  • Chamber temperatures from RT to 300°C ± 1°C
  • Precursor temperatures from RT to 150°C ± 2°C (w/ heating jacket)
  • Smallest footprint on market, bench top installation and cleanroom compatible
  • Simple system maintenance and lowest utilities and precursor usage on market
  • Streamlined chamber design and small chamber volume
  • Fast cycling capability and high exposure, deep penetration processing available
  • All metal sealed from precursor to chamber.
  • Typical Operating Pressure
  • Full HW and SW interlocks for safe operation in multi-user environment
  • 110 – 220 VAC, single phase, 50/60Hz, 15 Amp (10A for 220V)
  • Weight approximately 100lbs (45 kgs)
At-400 Anric Technologies
  • Customized chuck/platen (square, indents for smaller pieces, powders)
  • Customized chamber (thicker substrates)
  • ATOzone  – Ozone generator (required for some films: Pt, Ir, SiO2, MoO2, high quality Al2O3 below 60°C, high quality HfO2)
    • Optional – Ozone Safety Monitor w real time detection of ambient ozone gas
  • QCM (Quartz Crystal Microbalance)
  • Glovebox integration (typically required to not expose substrate to moisture; Sulfides, etc..)
  • External control – PC/software link (allows programing and running, remotely)
  • Ventable Precursor cabinet
  • Spare Chamber
  • IGPA (inert gas pressure assist)for low vapor pressure precursors
  • Higher temperatures on precursors (to 180°C)
  • Third counter reactant
    • Software control of third counter reactant
AT610cad w dimensions Rev2
  • For detailed instructions see our presentation and video instructions: “AT410/610 Installation and Start-up
  • N2 purge gas should be >99.9995% with a shutoff valve (regulated to 10 – 30 psi, metal sealed), .
    • Input line is 1/4 female VCR compression fitting
    • Attach > 99.9995% nitrogen (UHP) purge gas via 1/4″ metal line to the 1/4″ compression fitting on back
  • Attach 90-110 psi CDA (clean dry air) via 1/4″ polyethylene  tubing or metal line to the other 1/4″ compression fitting marked CDA (Clean Dry Air)
  • Min 12cfm wet pump (**PTFE vacuum fluid (like Fomblin) required) (610 and 810 use larger pumps typically 19.5 cfm or higher)
    • NW25 (KF25) (1″) connection and also exhaust line (with > 5cfm draw)
    • Greater than 1 meter should use NW40 (1.5″) exhaust line
  • Precursor’s attach via female VCR elbows (always use new gaskets).
    • Elbow: 1/4″ gasket first (with gloves on)
  • For precursor attachment please refer to AT410/AT610 Tool and Software Operation.
  • For detailed instructions see our presentation and video instructions: “AT610 Installation and Start-up
    • Human Machine Interface (HMI) PLC system with a 7” touch screen
      panel
    • Advanced controls suitable for the deposition of standard ALD cycles as
      well as e.g. Nanolaminates, Doped Thin Films and Ternary Thin Films
    • Recipe database for high quality, tested processes
    • Custom recipe input screen
    • Real time display of process status
    • Individually programmable heated source temperatures
    • Built-in pulsing sequences for ternary compounds and nano-laminates
    • Quick running with simple questions to get user going
      • Input subcycles and overall cycles
AT410 screen

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  • Let us configure a tool to meet your specific requirement for example custom chambers, custom wafer holders – Ask us
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  • If you don’t think we have the equipment you need you will be surprised – Ask us