The AT410 is the most cost-effective thermal ALD tool on the market.
- Small Footprint Desktop System – W: 24.5″ (62.3 cm) x D: 24″ (61 cm) x H: 15.75″ (40 cm)
- NEW Available Hollow Cathode RF Source, 300 W Plasma (AT – 410 Plus)
- Semiconductor-grade metal sealed lines and high temperature compatible fast pulsing ALD valves.
- Ultrafast MFC for integrated inert gas purge.
- 4″ circular chuck customizable for smaller sizes or other shapes (11 mm tall).
- 3 organometallic precursors up to 175 °C and 2 (up to 3) counter reactants.
- Heated lines throughout (from precursor to chamber).
- All aluminum (semiconductor grade) chamber ‒ range up to 320°C (optional chuck to 450 + °C)
- 7″ touchscreen PLC controller (no PC required)
- Small Footprint Desktop System (< 0.15m3 | 2.5 sq ft)
- High temperature compatible fast pulsing ALD valves with ultrafast MFC for integrated inert gas purge.
- 4″ circular chuck customizable for smaller sizes or other shapes (11 mm tall).
- 3 organometallic precursors up to 175 °C and 2 (up to 3) counter reactants.
- Heated lines throughout (from precursor to chamber).
- High exposure (for trenches and porous substrates) and static processing mode
- All aluminum (semiconductor grade) chamber ‒ range up to 320 °C
- 7″ touchscreen PLC controller (no PC required)
- Lifetime software upgrades included
- 1 year warranty
- Chamber temperatures from RT to 320 °C ± 1 °C; Precursor temperatures from RT to 175 °C ± 2°C (w/ heating jacket)
- Smallest footprint on market (2.5 sq ft), bench top installation and cleanroom compatible
- Simple system maintenance and lowest utilities and precursor usage on the market
- Streamlined chamber design and small chamber volume
- Fast cycling capability (up to 1.2nm/min Al2O3) and high exposure, deep penetration processing available
- Full HW and SW interlocks for safe operation even in multi-user environment
- Customized chuck/platen (square, indents for smaller pieces, batch)
- Customized chamber (thicker substrates, example: optical components)
- NEW Optional chuck to 450 + °C (ask us)
- NEW Available Hollow Cathode RF Source, 300 W Plasma (AT – 410 Plus)
- ATOzone – Ozone generator (required for some films: Pt, Ir, SiO2, MoO2, high quality Al2O3 below 60°C, high quality HfO2)
- Optional – Ozone Safety Monitor w real time detection of ambient ozone gas
- QCM (Temperature-compensating Quartz Crystal Microbalance)
- Glovebox integration (typically required to not expose substrate to moisture; Nitrides, Sulfides, etc..)
- External control – PC/software link (allows programing and running, remotely)
- Ventable Precursor cabinet
- Spare Chamber
- IGPA (inert gas pressure assist) for low vapor pressure precursors
- Third counter reactant
- Software control of third counter reactant
- For detailed instructions see our presentation and video instructions: “AT410/610 Installation and Start-up“
- N2 purge gas should be >99.9995% with a shutoff valve (regulated to 10 – 30 psi, metal sealed), .
- Input line is 1/4 female VCR compression fitting
- Attach > 99.9995% nitrogen (UHP) purge gas via 1/4″ metal line to the 1/4″ compression fitting on back
- Attach 90-110 psi CDA (clean dry air) via 1/4″ polyethylene tubing or metal line to the other 1/4″ compression fitting marked CDA (Clean Dry Air)
- Min 12cfm wet pump (**PTFE vacuum fluid (like Fomblin) required) (610 and 810 use larger pumps typically 19.5 cfm or higher)
- NW25 (KF25) (1″) connection and also exhaust line (with > 5cfm draw)
- Greater than 1 meter should use NW40 (1.5″) exhaust line
- Precursor’s attach via female VCR elbows (always use new gaskets).
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- Elbow: 1/4″ gasket first (with gloves on)
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- For precursor attachment please refer to AT410/AT610 Tool and Software Operation.
For detailed instructions see our presentation and video instructions: “AT410_610 Installation and Start-up“
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- Human Machine Interface (HMI) PLC system with a 7” touch screen
panel - Advanced controls suitable for the deposition of standard ALD cycles as
well as e.g. Nanolaminates, Doped Thin Films and Ternary Thin Films - Recipe database for high quality, tested processes
- Custom recipe input screen
- Real time display of process status
- Individually programmable heated source temperatures
- Built-in pulsing sequences for ternary compounds and nano-laminates
- Quick running with simple questions to get user going
- Input subcycles and overall cycles
- Human Machine Interface (HMI) PLC system with a 7” touch screen
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