AT 200M – The Most Cost Effective ALD System on the Market
Anric Technologies introduces the smallest footprint ALD (Atomic Layer Deposition) tool available on the market. The AT200M is small enough to fit in a glovebox and therefore the perfect solution for moisture or air-sensitive depositions.
- Small footprint (~ 15 in3 or 38.1 cm3)
- One precursor and one counter-reactant
- Semiconductor grade components
- Metal-sealed lines
- Vented precursor enclosure
- High temperature compatible, fast pulsing ALD valves with an ultra fast MFC for integrated inert gas purge
- Precursors (up to 150°C) , manifold, chamber heated to insure no condensation.
- Robust PLC driven user interface
- Stainless steel chamber can be heated to 250°C.
- Small footprint (~ 15 in3 or 38.1 cm3) to easily fit in glovebox or besides an evaporator for SEM/TEM.
- One precursor and one counter-reactant
- Vented precursor enclosure
- High temperature compatible, fast pulsing ALD valves with an ultra fast MFC for integrated inert gas purge – standard
- Metal sealed lines
- Precursors (up to 150°C) , manifold, chamber heated to insure no condensation.
- Stainless steel chamber can be heated to 250°C.
- 5″ Display with integrated PLC controller (no PC required)
- Chamber temperatures from RT to 250°C ± 1 °C
- Precursor temperatures from RT to 150°C ± 2°C (w/ heating jacket)
- Smallest footprint on market (1.6 sq ft), bench top installation, cleanroom compatible, also fits in glovebox.
- Simple system maintenance and low utilities and precursor usage.
- Small chamber volume
- Very Fast cycling capability.
- Full HW and SW interlocks for safe operation even in multi-user environment
- Customized chuck/platen (square, circular, double substrates, baskets, smaller pieces, thicker substrates).
- ATOzone – Ozone generator (required for some films: Pt, Ir, SiO2, MoO2, high quality Al2O3 below 60°C, high quality HfO2)
- Optional – Ozone Safety Monitor w real time detection of ambient ozone gas
- Powder coating drum
- No Glovebox integration required (fits in glove box)
- External control – PC/software link (allows programing and running, remotely)
- Ventable Precursor cabinet included
- Spare Chambers
For detailed instructions see our instructions: “AT200M Installation and Start-up“
- N2 purge gas should be >99.9995% with a shutoff valve (regulated to 10 – 30 psi, metal sealed),
- Attach the nitrogen (UHP) purge gas via 1/4″ metal sealed line to 1/4″ compression fitting on back
- Attach 90-110 psi CDA (clean dry air) via 1/4″ polyethylene tubing or metal line to the other 1/4″ compression fitting
- Attach pump with appropriate 1″ vacuum (metal (SS) preferred) hose (KF25), O-Ring and clamp
- The other (exhaust side) side of vacuum pump (* perfluorinated vacuum oil like Fomblin, required) should go to standard lab exhaust or roof with > 5cfm draw (1″ tubing, also).
- Greater than 1 meter requires should use 1.5″ (NW40).
- Precursor’s attach via female VCR elbows (always use new gaskets).
- 1/4″ gasket first (with gloves on)
- For precursor attachment please refer to “AT200M Tool and Software Operation”
For detailed instructions see our presentation and video instructions: “AT200M Installation and Start-up“
- Human Machine Interface (HMI) PLC system with a 5” touch screen
panel - Advanced controls suitable for the deposition of standard ALD cycles
- Recipe database for high quality, tested processes
- Custom recipe input screen
- Real time display of process status
- Individually programmable heated source temperatures
- Built-in pulsing sequences for ternary compounds and nano-laminates
- Quick running with simple questions to get user going
- Input subcycles and overall cycles
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